APA

Thielmann J., . (1977). Reliability considerations in the use of integrated circuit packaging systems in an automotive environment. Warrendale, PA: Society of Automotive Engineers. Paper nr 77 02 29.

Chicago

Thielmann JN, . 1977. Reliability considerations in the use of integrated circuit packaging systems in an automotive environment. Warrendale, PA: Society of Automotive Engineers. Paper nr 77 02 29.

Harvard

Thielmann J., . (1977). Reliability considerations in the use of integrated circuit packaging systems in an automotive environment. Warrendale, PA: Society of Automotive Engineers. Paper nr 77 02 29.

MLA

Thielmann JN, . Reliability considerations in the use of integrated circuit packaging systems in an automotive environment. Warrendale, PA: Society of Automotive Engineers. Paper nr 77 02 29. 1977.