Normal view
MARC view
Reliability considerations in the use of integrated circuit packaging systems in an automotive environment Thielmann, JN
Publication details: Warrendale, PA Society of Automotive Engineers. Paper nr 77 02 29, 1977Description: 34 sSubject(s): Bibl.nr: VTI P2000Location:| Current library | Call number | Status | Date due | Barcode |
|---|---|---|---|---|
| Statens väg- och transportforskningsinstitut | Available |