Reliability considerations in the use of integrated circuit packaging systems in an automotive environment Thielmann, JN
Publication details: Warrendale, PA Society of Automotive Engineers. Paper nr 77 02 29, 1977Description: 34 sSubject(s): Micro | Electronics | Car | Technology | Design (overall design) | Failure | 91Bibl.nr: VTI P2000Location:| Current library | Call number | Status | Date due | Barcode |
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Statens väg- och transportforskningsinstitut
VTI:s bibliotek i Linköping |
Available |